Ligas de cobre

It Can Efficiently Manufacture Complex And Precise Small Parts. Metal Powder Particles Are Small And Have Good Fluidity. With The Help Of Binders, They Can Fill The Fine Structure Of The Mold. After Molding And High-Temperature Sintering, They Can Not Only Retain The Strength Close To That Of Traditional Processing, But Also Realize Thin-Walled, Special-Shaped And Other Designs That Are Difficult To Achieve With Processos tradicionais, mantendo a excelente condutividade elétrica e térmica das ligas de cobre .

Attention Should Be Paid To Anti-Oxidation During Processing. Copper Is Easily Oxidized During High-Temperature Sintering And Requires Hydrogen Or Vacuum Environment For Protection. The Surface Of Molded Parts Needs To Be Electroplated Or Coated To Improve Corrosion Resistance, Which Is More Suitable For High-End Fields Such As Electronic Connectors And Micro Heat Dissipation Components With High Requirements For Conductivity And Heat Dissipação .

LEVIE DO LEITO: <15 dias
Tolerâncias: ± 0,3% ~ ± 0,5%
Tamanho da peça máxima: entre em contato conosco .
Cobre disponível em DAZAO: Brass General, Bronze Geral de lata etc .